At Mashable by Charlie White.
“…3M and IBM have unlocked a secret low-tech shortcut.”
“It’s an adhesive that dissipates heat so efficiently that layer upon layer of chips can be stacked on top of each other into silicon ‘towers’ up to 100 layers high, glued together with this special adhesive that keeps things cool. The result? Faster chips for computers, laptops, smartphones and anything else that uses microprocessors.”